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Infrastructure Engineering, Inc. (466) Save Scholarship/Grant
This scholarship/grant was graciously shared with you by: Reginald Culpepper.
Undergraduate or Graduate pursuing degree in civil engineering or other engineering field, preferably at an HBCU

Minimum GPA: 3.0
Dollar Amount: $2,000
Deadline(s): February 27, 2023
Scholarship/Grant Sponsor: Infrastructure Engineering, Inc.
Award Type: Scholarship Money
Scholarship/Grant Site: https://www.cvent.com/c/abstracts/d7ae1a31-270f-4a25-8bde-bb8756f7da54
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